High pressure crystal growth apparatuses and associated methods

ABSTRACT

High pressure synthesis of various crystals such as diamond, cBN and the like can be carried out using reaction assemblies suitable for use in methods such as temperature gradient methods. The reaction assembly can be oriented substantially perpendicular to gravity during application of high pressure. Orienting the reaction assembly in this manner can avoid detrimental effects of gravity on the molten catalyst, e.g., convection, hence increasing available volumes for growing high quality crystals. Multiple reaction assemblies can be oriented in series or parallel, each reaction assembly having one or more growth cells suitable for growth of high quality crystals. Additionally, various high pressure apparatuses can be used. A split die design allows for particularly effective results and control of temperature and growth conditions for individual crystals.

CLAIM OF PRIORITY

This application is a continuation-in-part of U.S. patent applicationSer. No. 10/757,715, filed Jan. 13, 2004, now U.S. Pat. No. 7,128,547,which is herein incorporated by reference.

FIELD OF THE INVENTION

The present invention relates generally to devices and methods forgrowing crystalline materials at high pressures and high temperatures.Accordingly, the present invention involves the fields of chemistry,metallurgy, materials science, physics, and high pressure technology.

BACKGROUND OF THE INVENTION

Apparatuses for achieving high pressures have been known for over a halfcentury. Typical ultrahigh pressure apparatuses include piston-cylinderpresses, cubic presses, tetrahedral presses, belt presses, girdlepresses, and the like. Several of these apparatuses are capable ofachieving ultrahigh pressures from about 4 GPa to about 7 GPa.

High pressure apparatuses are commonly used to synthesize diamond andcubic boron nitride (cBN). Generally, source materials and other rawmaterials can be selected and assembled into a high pressure assemblywhich is then placed in the high pressure apparatus. Under highpressure, and typically high temperature, the raw materials combine toform the desired product. More specifically, graphite, non-diamondcarbon or even diamond can be used as a source material in diamondsynthesis, while hexagonal boron nitride (hBN) can be used in cBNsynthesis. The raw material can then be mixed or contacted with acatalyst material. Diamond synthesis catalysts such as Fe, Ni, Co, andalloys thereof are commonly used. Alkalis, alkaline earth metals, orcompounds of these materials can be used as the catalyst material in cBNsynthesis. The raw material and catalyst material can then be placed ina high pressure apparatus wherein the pressure is raised to an ultrahighpressure, e.g., 5.5 GPa. An electrical current can then be passedthrough either a graphite heating tube or graphite directly. Thisresistive heating of the catalyst material is sufficient to causemelting of the catalyst material, e.g., typically about 1300° C. fordiamond synthesis and about 1500° C. for cBN synthesis. Under suchconditions, the source material can dissolve into the catalyst and thenprecipitate out in a crystalline form as either diamond or cBN.

Typically, either an isothermal method or temperature gradient method isused to synthesize diamond. Each method takes advantage of thesolubility of carbon under various conditions, e.g., temperature,pressure, and concentrations of materials. The isothermal methodinvolves use of a carbon source material, metal catalyst, and sometimesa diamond seed. The carbon source is most frequently graphite or otherforms of carbon material. Under high pressures and high temperatures,graphite is much more soluble in molten catalyst than diamond.Therefore, graphite tends to dissolve or disperse into the moltencatalyst, or create a colloidal suspension therewith, up to thesaturation point. Excess carbon can then precipitate out as diamond.Typically, a diamond seed can be surrounded by a thin envelope of moltencatalyst, e.g., Fe, Ni, Co, and their alloys. In this case, the carboncan dissolve into and diffuse across the molten catalyst envelope towardthe diamond seed of a diamond nucleus. Due to the presence of a thinmolten catalyst layer, this type of isothermal process is also oftenreferred to as a thin film process.

In contrast, the temperature gradient method involves maintaining atemperature gradient between a carbon source and the diamond seeds whichare separated by a relatively thick layer of molten catalyst. The carbonsource is kept at a relatively higher temperature than the diamond seed.As such, the carbon is more soluble in the hotter regions. The carbonthen diffuses toward the cooler region where the diamond seed islocated. The solubility of carbon is reduced in the cooler regions, thusallowing carbon to precipitate as diamond at the diamond seed.Typically, the molten catalyst layer is relatively thick in order tomaintain a sufficient temperature gradient, e.g., 20° C. to 50° C., andis therefore also often referred to as a thick film process.

Unfortunately, currently known high pressure crystal synthesis methodshave several drawbacks which limit their ability to produce large,high-quality crystals. For example, isothermal processes are generallylimited to production of smaller crystals useful as superabrasives incutting, abrading, and polishing applications. Temperature gradientprocesses can be used to produce larger diamonds; however, productioncapacity and quality are limited. Several methods have attempted toovercome these limitations. Some methods incorporate multiple diamondseeds; however, a temperature gradient among the seeds preventsachieving optimal growth conditions at more than one seed. Some methodsinvolve providing two or more temperature gradient reaction assembliessuch as those described in U.S. Pat. No. 4,632,817. Unfortunately, highquality diamond is typically produced only in the lower portions ofthese reaction assemblies. Some of these methods involve adjusting thetemperature gradient to compensate for some of these limitations.However, such methods involve additional expense and variables in orderto control growth rates and diamond quality simultaneously overdifferent temperatures and growth materials.

Therefore, apparatuses and methods which overcome the above difficultieswould be a significant advancement in the area of high pressure crystalgrowth.

SUMMARY OF THE INVENTION

It has been recognized by the inventor that it would be advantageous todevelop methods and devices which allow for larger productionthroughput, decreased production costs, and improved quality of largesynthetic crystals such as diamond, cBN, jadeite, garnet, and other highpressure crystals. Further, apparatuses and methods which allowindividual temperature control of crystalline seeds, each being locatedto provide optimal growth conditions, are described herein.

In accordance with the present invention, a high pressure system caninclude at least one high pressure apparatus. The high pressureapparatus can include a plurality of pressure members which form a highpressure volume. Additionally, the high pressure apparatus includes atleast one high pressure reaction assembly which can be placed in thehigh pressure volume. The reaction assembly can include a catalystlayer, at least one crystalline seed, and a raw material layer to format least one growth cell. Typically, the crystalline seed and rawmaterial can be separated by catalyst material such that a temperaturegradient can be maintained within the growth cell. The raw materiallayer can be configured to allow raw material to diffuse into thecatalyst layer along a bulk raw material diffusion direction. Further,the reaction assembly can be oriented substantially perpendicular togravity during application of high pressure. Orienting the reactionassembly in this manner can avoid detrimental effects of gravity on themolten catalyst, e.g., convection, hence increasing available volumesfor growing high quality crystals.

In another aspect of the present invention, the reaction assembly caninclude a plurality of growth cells. The plurality of growth cells canshare a common raw material layer. Further, each growth cell can havebulk raw material diffusion directions substantially perpendicular togravity and substantially collinear with one another.

In another aspect of the present invention, a plurality of reactionassemblies can be oriented in series within the high pressure volume.

In yet another aspect of the present invention, the high pressuresystems can include a plurality of high pressure apparatuses oriented inseries or in parallel. High pressures can be achieved using a variety ofdevices such as split die devices, piston-cylinder presses, girdledevices, belt devices, tetrahedral presses, cubic presses, toroidaldevices, and the like. In one preferred embodiment, the pressure can beachieved using a split die device.

In still another aspect, a plurality of split die devices can beoriented in series and share at least one common anvil. Similarly, aplurality of split die devices can be oriented in parallel such that thesplit die devices share common force members.

In another aspect of the present invention, crystalline bodies can begrown at high pressures using the high pressure systems describedherein. Optionally, the high pressure apparatus can be oriented suchthat said chamber axis is substantially perpendicular to gravity. A highpressure reaction assembly can be placed at least partially within thehigh pressure volume such that the assembly axis is orientedsubstantially perpendicular to gravity. A pressing force can then beapplied to the reaction assembly substantially along the chamber axiswhich is sufficient to provide high pressures within the reactionassembly.

In a detailed aspect of the present invention, the growth cells can beconfigured for high pressure growth of crystalline bodies such asdiamond, cBN, or other high pressure materials.

In yet another detailed aspect, temperature profiles within theplurality of growth cells can be actively controlled such that eachcrystalline seed has a lower temperature than a corresponding rawmaterial. In order to facilitate active control of temperature profileswithin the growth cell, heating and cooling elements can be placed inthermal contact with either the raw material layers and/or crystallineseeds.

In still another detailed aspect, the active control of temperatureprofiles and reaction assemblies of the present invention enableimproved growth conditions for high quality crystals. As such, theapparatuses and methods of the present invention allow growth of gemquality diamonds with high quality and improved production capacities.The gem quality diamonds can have a size of from about 0.25 carat toabout 25 carats, depending on specific materials and growth conditions,e.g., cycle time.

There has thus been outlined, rather broadly, various features of theinvention so that the detailed description thereof that follows may bebetter understood, and so that the present contribution to the art maybe better appreciated. Other features and advantages of the presentinvention will be apparent from the following detailed description ofthe invention and corresponding drawings, taken with the accompanyingclaims, or may be learned by the practice of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a high pressure system in accordancewith an embodiment of the present invention having two growth cells anda single reaction assembly;

FIG. 2 is a cross-sectional view of a high pressure system in accordancewith an embodiment of the present invention having four growth cells andtwo reaction assemblies in series;

FIG. 3 is a cross-sectional view of a high pressure system in accordancewith another embodiment of the present invention having six growth cellsand three reaction assemblies in series;

FIG. 4 is a cross-sectional view of a high pressure split die apparatusin accordance with an embodiment of the present invention;

FIG. 5A is a perspective view of two die segments and correspondingsupport members in accordance with an embodiment of the presentinvention;

FIG. 5B is a perspective view of the die segments of FIG. 5A assembledto form a die chamber;

FIG. 6A is a perspective view of four die segments and correspondingsupport members in accordance with an embodiment of the presentinvention;

FIG. 6B is a perspective view of the die segments of FIG. 6A assembledto form a die chamber;

FIG. 7A is a perspective view of four die segments in accordance with anembodiment of the present invention;

FIG. 7B is a perspective view of the die segments of FIG. 7A assembledto form a die chamber;

FIG. 8A is a perspective view of two die segments and correspondingsupport members in accordance with another embodiment of the presentinvention;

FIG. 8B is a perspective view of the die segments of FIG. 8A assembledto form a die chamber;

FIG. 9 is a side view of four die segments mounted on two supportmembers in accordance with an embodiment of the present invention;

FIG. 10 is a side view of an axial press having two die segments andcorresponding support members mounted therein;

FIG. 11 is a top view of a contoured support member in accordance withan embodiment of the present invention;

FIG. 12 is a top view of a portion of a support member and die segmenthaving a contoured contact surface in accordance with an embodiment ofthe present invention;

FIG. 13 is a cross-sectional view of a high pressure system inaccordance with an embodiment of the present invention having two highpressure apparatuses in series sharing a common anvil;

FIG. 14 is a cross-sectional view of a high pressure system inaccordance with an embodiment of the present invention having two highpressure apparatuses in parallel sharing common discrete forces; and

FIG. 15 is a perspective view of a high pressure system in accordancewith an embodiment of the present invention having a plurality of highpressure apparatuses oriented in parallel.

The above figures are provided for illustrative purposes only and arenot always drafted to scale. As such, variations may be had as todimensions and proportions illustrated without departing from the scopeof the present invention.

DETAILED DESCRIPTION

Reference will now be made to the exemplary embodiments illustrated inthe drawings, and specific language will be used herein to describe thesame. It will nevertheless be understood that no limitation of the scopeof the invention is thereby intended. Alterations and furthermodifications of the inventive features, process steps, and materialsillustrated herein, and additional applications of the principles of theinventions as illustrated herein, which would occur to one skilled inthe relevant art and having possession of this disclosure, are to beconsidered within the scope of the invention. It should also beunderstood that terminology employed herein is used for the purpose ofdescribing particular embodiments only and is not intended to belimiting.

A. Definitions

In describing and claiming the present invention, the followingterminology will be used.

The singular forms “a,” “an,” and “the” include plural referents unlessthe context clearly dictates otherwise. Thus, for example, reference to“a crystalline seed” includes reference to one or more of suchmaterials, and reference to “a high pressure apparatus” includesreference to one or more of such devices.

As used herein, “anvil” refers to any solid mass capable of at leastpartially entering the die chamber sufficient to increase pressurewithin the reaction volume. Those skilled in the art will recognizevarious shapes and materials used for such anvils. Typically, the anvilshave a frustoconical shape.

As used herein, “complementary” when used with respect to die segments,refers to parts which fit together to form a specified reaction volumeconfiguration. The die segments “complement” each other by being shapedand configured to be held together under high pressures with minimal orno space between contact surfaces and to form an open die chamber.Frequently, complementary die segments can be configured to allowplacement of a gasket or other material between contact surfaces toimprove sealing of the reaction volume. Thus, complementary die segmentsneed not be, and typically are not, in direct physical contact and caninclude intervening materials.

As used herein, “discrete force” refers to a force vector, which has anidentifiable source and is associated with a single force vector, asopposed to a summation of somewhat random forces acting on a body, e.g.,a gas or liquid surrounding a body.

As used herein, “high pressure volume” and “reaction volume” can be usedinterchangeably and refer to at least a portion of the die chamber inwhich conditions can be maintained at a high pressure sufficient foruseful testing and/or growth of materials which are placed therein, e.g.usually the reaction volume can include a charge of raw material, i.e.nutrient source material, and catalyst materials for synthesis andgrowth of crystalline bodies. The reaction volume can be formed within ahigh pressure assembly placed at least partially within the die chamber.

As used herein, “high pressure assembly” and “reaction assembly” can beused interchangeably and refer to an assembly of materials which are tobe subjected to high pressure. Most often, these materials can be placedin the reaction volume at least partially surrounded by a pressuremedium and/or gasket assembly. However, those skilled in the art willrecognize that the high pressure assembly can be formed of almost anymaterial which can then be subjected to high pressure for such purposesas chemical reactions, crystalline growth, high pressure propertymeasurements, and the like. A wide variety of high pressure assembliesare known and can be used in the present invention. Such high pressureassemblies can also include inert gaskets, separators, or othermaterials which improve HPHT conditions.

As used herein, “high pressure” refers to pressures above about 1 MPaand preferably above about 200 MPa.

As used herein, “ultrahigh pressure” refers to pressures from about 1GPa to about 15 GPa, and preferably from about 4 GPa to about 7 GPa.

As used herein, “alloy” refers to a solid solution or liquid mixture ofa metal with a second material, said second material may be a non-metal,such as carbon, a metal, or an alloy which enhances or improves theproperties of the metal.

As used herein, “seeds” refer to particles of either natural orsynthetic diamond, super hard crystalline, or polycrystalline substance,or mixture of substances and include but are not limited to diamond,polycrystalline diamond (PCD), cubic boron nitride, SiC, and the like.Crystalline seeds can be used as a starting material for growing largercrystals and help to avoid random nucleation and growth of crystal.

As used herein, “growth cell” refers to an assembly of crystalline seedand raw material separated by a catalyst layer. In context of thepresent invention, this typically refers to a growth cell configured fortemperature gradient controlled growth; however growth cells configuredfor isothermal growth or other crystal growth methods can also be used.

As used herein, “raw material” refers to materials used to form acrystal. Specifically, raw material is a source of material whichprovides a nutrient for growth of a crystal, e.g., carbon, hBN, etc.

As used herein, “superabrasive” refers to particles of diamond or cBN,including sintered polycrystalline forms of diamond and cBN.

As used herein, “precursor” refers to an assembly of crystalline seeds,catalyst material, and a raw material. A precursor describes such anassembly prior to the crystalline or diamond growth process, i.e. a“green body.”

As used herein, “inclusion” refers to entrapment of non-diamond materialwithin a growing crystal. Frequently, the inclusion is a catalyst metalenclosed within the crystal under rapid growth conditions.Alternatively, inclusions can be the result carbon deposits forminginstead of diamond at the interface between a crystal growth surface ofthe diamond and the surrounding material. In general, inclusions aremost often formed by the presence of substantial amounts of carbon atthe growth surface of the diamond and/or inadequate control oftemperature and pressure conditions during HPHT growth.

As used herein, “euhedral” means idiomorphic, or having an unalterednatural shape containing natural crystallographic faces resulting fromunimpeded growth of crystal planes.

As used herein, “contacting” refers to physical intimate contact betweentwo materials. For example, a crystalline seed can be placed“contacting” a catalyst layer. As such, the crystalline seed can be incontact with a surface of the catalyst layer, partially embeddedtherein, or fully embedded in the catalyst layer.

As used herein, “thermal contact” refers to proximity between materialswhich allows for thermal transfer from one material to another.Therefore, thermal contact does not require that two materials be indirect physical contact. Materials can be chosen having various thermalconductivities so as to enhance or hinder thermal contact betweenmaterials as desired.

As used herein, “bulk” refers to an average or collective property. Forexample, a bulk diffusion direction would indicate the average directionof diffusion of a dissolved material despite local fluctuations indiffusion directions and/or diffusion rates of individual atoms.

As used herein, “chamber axis” refers to an axis which is substantiallyalong the center of an open space of the die chamber and is oftenparallel to the bulk diffusion direction or temperature gradient inwhich raw material diffuses during crystal growth under thick filmprocess conditions.

As used herein, “gem quality” refers to crystals having no visibleirregularities (e.g., inclusions, defects, etc.) when observed by theunaided eye. Crystals grown in accordance with the present inventionexhibit a comparable gem quality to that of natural crystals which aresuitable for use in jewelry.

As used herein, “substantially free of” or the like refers to the lackof an identified element or agent in a composition. Particularly,elements that are identified as being “substantially free of” are eithercompletely absent from the composition, or are included only in amountswhich are small enough so as to have no measurable effect on thecomposition.

Concentrations, amounts, and other numerical data may be presentedherein in a range format. It is to be understood that such range formatis used merely for convenience and brevity and should be interpretedflexibly to include not only the numerical values explicitly recited asthe limits of the range, but also to include all the individualnumerical values or sub-ranges encompassed within that range as if eachnumerical value and sub-range is explicitly recited.

For example, a numerical range of about 1 to about 4.5 should beinterpreted to include not only the explicitly recited limits of 1 toabout 4.5, but also to include individual numerals such as 2, 3, 4, andsub-ranges such as 1 to 3, 2 to 4, etc. The same principle applies toranges reciting only one numerical value, such as “less than about 4.5,”which should be interpreted to include all of the above-recited valuesand ranges. Further, such an interpretation should apply regardless ofthe breadth of the range or the characteristic being described.

B. The Invention

Reference will now be made to the drawings in which the various elementsof the present invention will be given numeral designations and in whichthe invention will be discussed. It is to be understood that thefollowing description is only exemplary of the principles of the presentinvention, and should not be viewed as narrowing the appended claims.

Referring now to FIG. 1, a high pressure apparatus is shown generally at200 having a plurality of pressure members 202, 204, 206, and 208. FIG.1 illustrates a girdle-type high pressure split die apparatus, althoughany high pressure device capable of reaching pressures and temperaturesdescribed herein can be used. Such devices are described in more detailin conjunction with one alternative embodiment below. The high pressureapparatus can be configured to form a high pressure volume.

A high pressure reaction assembly 210 can be configured for placement inthe high pressure volume. The reaction assembly can typically includematerials for growing a crystalline body from a crystalline seed. In oneaspect, materials suitable for a reaction assembly can include at leastone crystalline seed, a catalyst layer, and a raw material layer. Thematerials can be configured for temperature gradient controlled crystalgrowth. As such, the crystalline seed can be separated from the rawmaterial layer by the catalyst layer to form a growth cell.

In the embodiment of FIG. 1, the reaction assembly 210 includes a firstcatalyst layer 212 having a crystal growth surface 214 and a rawmaterial flux surface 216. The catalyst layer can be formed of anysuitable catalyst material, depending on the desired grown crystal.Catalyst materials suitable for diamond synthesis can include metalcatalyst powder, solid layers, or solid plates comprising any metal oralloy which includes a carbon solvent capable of promoting growth ofdiamond from carbon source materials. Non-limiting examples of suitablemetal catalyst materials can include Fe, Ni, Co, Mn, Cr, and alloysthereof. Several common metal catalyst alloys can include Fe—Ni, e.g.,INVAR alloys, Fe—Co, Ni—Mn—Co, and the like. Currently preferred metalcatalyst materials are Fe—Ni alloys, such as Fe-35Ni, Fe-31Ni-5Co,Fe-50Ni, and other INVAR alloys, with Fe-35Ni being the most preferredand readily available. Alternatively, catalyst layers can be formed bystacking layers of different materials together to produce amulti-layered catalyst layer or providing regions of different materialswithin the catalyst layer. For example, nickel and iron plates orcompacted powders can be layered to form a multi-layered Fe—Ni catalystlayer. Such a multi-layered catalyst layer can reduce costs and/or beused to control growth conditions by slowing or enhancing initial growthrates at a given temperature. In addition, the catalyst materials underdiamond synthesis can include additives which control the growth rateand/or impurity levels of diamond, i.e. via suppressing carbondiffusion, prevent excess nitrogen and/or oxygen from diffusing into thediamond, or effect crystal color. Suitable additives can include Mg, Ca,Si, Mo, Zr, Ti, V, Nb, Zn, Y, W, Cu, Al, Au, Ag, Pb, B, Ge, In, Sm, andcompounds of these materials with C and B.

Similarly, catalyst materials suitable for cBN synthesis can include anycatalyst capable of promoting growth of cBN from suitable boron nitrideraw materials. Non-limiting examples of suitable catalyst materials forcBN growth include alkali metals, alkaline earth metals, and compoundsthereof. Several specific examples of such catalyst materials caninclude lithium, calcium, magnesium, nitrides of alkali and alkalineearth metals such as Li₃N, Ca₃N₂, Mg₃N₂, CaBN₂, and Li₃BN₂. The catalystmaterials under cBN synthesis can further include very minor amounts ofadditives which control the growth rate or interior color of cBN crystalsuch as Si, Mo, Zr, Ti, Al, Pt, Pb, Sn, B, C, and compounds of thesematerials with Si, B, and N.

The catalyst layer 212 can be any suitable dimension which allows fordiffusion of raw materials into the catalyst layer and maintenance of atemperature gradient. Typically, the catalyst layer can be from about 1mm to about 20 mm in thickness. However, thicknesses outside this rangecan be used depending on the desired growth rate, magnitude oftemperature gradient, and the like.

At least one crystalline seed 218 can contact the catalyst layer 212.Crystalline seeds can be placed contacting the crystal growth surface214 of the catalyst layer from a position external to the catalystlayer, e.g., as shown in FIG. 1. Alternatively, the crystalline seedscan be placed partially or wholly within the catalyst layer. The numberof crystalline seeds contacting the catalyst layer can vary from one toany practical number. Of course, the number of crystalline seedscontacting a catalyst layer can be a function of available area,crystalline seed size, final desired crystal size, and radialtemperature gradients, i.e. perpendicular to the bulk diffusiondirection discussed below. In one specific embodiment, a singlecrystalline particle can contact the catalyst layer of each growth cell.

The crystalline seeds can be any suitable seed material upon whichgrowth can occur for either diamond or cBN. In one aspect of the presentinvention, the crystalline seeds can be diamond seeds, cBN seeds, or SiCseeds. The synthesis of either diamond or cBN can utilize any of thelisted crystalline seeds which have similar crystal structures.Frequently, diamonds seeds are the preferred crystalline seeds fordiamond synthesis, although cBN or SiC seeds can also be used.Similarly, in some embodiments of cBN synthesis, cBN seeds can be used,although diamond or SiC seeds can also be used. Alternatively, thecrystalline seeds can be polycrystalline or multi-grained such that aplurality of smaller crystals are bonded together to form eachcrystalline seed.

Typically, the crystalline seeds can have a diameter of from about 30 μmto about 1 mm, and preferably from about 50 μm to about 500 μm. However,the present invention can be used in growth of almost any sizecrystalline seed. Allowing for larger crystalline seeds also reduces thegrowth time required to produce large gem quality crystals. Inparticular, diamond seeds suitable for use in the present invention canbe larger than typical diamond seeds, i.e. from about 200 μm to about500 μm, although the above ranges can also be effectively used. However,in some embodiments a smaller diamond seed may be desirable.Specifically, a final crystal grown from a relatively large crystallineseed can exhibit a discernable interface between the originalcrystalline seed and the grown crystal volume. Conversely, a smallercrystalline seed can result in a final crystal which has an obscured orsubstantially eliminated interface between the original crystalline seedand grown crystal.

In one alternative embodiment, the crystalline seed and catalyst layercan be separated by a partition layer. Under some circumstance,especially during early stages of crystal synthesis, a nutrientdeficient molten catalyst layer may completely dissolve the crystallineseed before the catalyst layer is sufficiently saturated with nutrient,i.e. raw material, to begin growth of the crystal. In order to reduce orprevent excessive dissolution of the crystalline seed(s), particularlyfor small seeds, a thin partition layer can be placed between thecrystalline seed and the catalyst material. For example, the partitionlayer can be in the form of a coating around the crystalline seed or maybe a layer along the growth surface which provides a temporary barrierto catalyst material. The partition layer can be formed of any material,metal, or alloy having a melting point higher than the melting point ofthe catalyst material. One exemplary partition layer material includesplatinum. Thus, the partition layer can preserve the crystalline seeduntil the catalyst layer is saturated (or substantially saturated) withnutrient material. The partition layer can be adjusted in thickness andcomposition to allow the partition layer to be substantially removed,i.e. dissolved or otherwise rendered a non-barrier, such that growth ofthe crystalline seed can occur once sufficient nutrient material isdissolved in the catalyst layer.

In an optional embodiment, a support layer 226 can be placed in contactwith the crystal growth surface 214 of the catalyst layer 212. Thesupport layer can be formed of any material which does not interferewith growth of the crystalline bodies. In some cases, the support layercan allow raw material to diffuse thereinto. Non-limiting examples ofmaterial suitable for support layers include NaCl, dolomite, talc,pyrophillite, metal oxides, and the like. In embodiments where thecrystalline seed 218 contacts the growth surface, the support layer canat least partially surround the crystalline seed.

A raw material layer 220 can be adjacent the raw material flux surface216 of the first catalyst layer 212. The raw material layer can beconfigured to provide a source of raw material for growth of a desiredcrystalline body such as diamond or cBN from a crystalline seed.Specifically, a carbon source can be used as the raw material fordiamond growth, while a low pressure phase boron nitride such as hBN(white graphite) or pyrolitic boron nitride (pBN) can be used as the rawmaterial for cBN growth. Under diamond growth conditions, the carbonsource layer can comprise a carbon source material such as graphite,amorphous carbon, diamond powder, and the like. In one aspect of thepresent invention, the carbon source layer can comprise high puritygraphite. Although a variety of carbon source materials can be used,graphite generally provides good crystal growth and improves homogeneityof the grown diamonds. Further, low resistivity graphite also provides acarbon source material which can also be readily converted to diamond.However, consideration should be given to the volume reductionassociated with conversion of graphite to diamond, i.e. design of a highpressure apparatus capable of compensating for the volume reduction. Forexample, stiffening of the gasket material and increase in internalfriction forces tends to limit the degree to which an apparatus cancompensate for volume reductions. Thus, some pressure decay is typicallyencountered. In order to minimize this effect, diamond powder can beused as a raw material, thereby increasing the time at which optimalpressure conditions can be maintained.

When using graphite as a carbon source, the pressure may decay as aresult of volume reduction as the graphite is converted to diamond. Oneoptional way to reduce this problem is to design the die chamber andcorresponding anvils such that the anvils can continue to advance tocompensate for the volume reduction and maintain a desired pressure,e.g., form a steeper throat angle in entrances to the die chamber. Forexample, compare FIG. 1 having a steeper throat angle to FIG. 4 having ashallow throat angle. As mentioned above, despite higher costs, usingdiamond powder as a raw material can also reduce the degree of volumereduction and further provides a high purity carbon source.

The high pressure reaction assemblies of the present invention can beassembled having a plurality of crystalline growth cells alignedsubstantially along an assembly axis. Each growth cell can include acrystalline seed, a catalyst layer, and a raw material layer. The highpressure reaction assembly can be placed at least partially within thehigh pressure volume such that the assembly axis is orientedsubstantially perpendicular to gravity, i.e. and usually substantiallyparallel to the chamber axis. Alternatively, the chamber axis can besubstantially parallel to gravity and substantially perpendicular to theassembly axis.

The raw material layer 220 can be configured to allow raw material todiffuse into the catalyst layer 212 along a bulk raw material diffusiondirection 222. The bulk raw material diffusion direction can be orientedsubstantially perpendicular to gravity 224 during application of highpressure. Orienting the reaction assembly in this manner substantiallyeliminates gravity effects within the reaction assembly which results inupper portions of typical vertical reaction assemblies producing poorquality crystals. Specifically, when the bulk diffusion direction ishorizontal, diffusion of raw material is increased by convection flow ofmolten catalyst. The rapid rising of heated raw material acceleratesgrowth of the crystals at the upper portions sufficiently to entrapcatalyst metal and form other inclusions resulting in a poor qualitycrystal. Typically, diffusion of raw material is toward the growthsurface 214, although the rate and direction of diffusion can beaffected by a variety of variables such as temperature, catalystpurities, catalyst layer density, growth of crystalline seed (which candisturb local flux of raw material), and the like. In one preferredaspect, the reaction assembly can be configured for temperature gradientcontrolled growth.

The high pressure apparatuses of the present invention can furtherinclude additional materials such as gaskets, separators, and the like.For example, FIG. 1 shows gaskets 328 which fill spaces between the diesegments and anvils. Optionally, a metal cone 330 can be placed betweengasket layers in order to help maintain a pressure gradient across thegasket region when using a relatively thick gasket. Further, a thickergasket can allow for a larger anvil stroke to compensate for pressuredecay during crystal growth. Additional metal cones can be included inconcentric layers of metal and gasket material, depending on expectedvolume reduction and the design of the reaction cell. Optional coppershims 332 can be used to reduce stress at the anvil 202 and 204surfaces, while also preventing corrosion due to volatiles driven out ofthe gasket materials. A steel ring 334 can be placed at each end of thereaction assembly 210 in order to transmit electrical current to agraphite heating tube, if used. Red salt (cuprous cupric salt)containing dispersed iron oxide can be used which slows heat transfer.Alternatively, zirconia or other materials can be added as furtherinsulation. High resistivity graphite can also be used as a heatingelement via resistive heating.

In an additional aspect of the present invention, the reaction assemblycan include a plurality of growth cells. Additional growth cells canshare common raw material layers and/or common support layers. Forexample, FIG. 1 illustrates a reaction assembly 210 having two growthcells 228 and 230. Growth cell 230 can include a second catalyst layer232 having a growth surface 236 and a raw material flux surface 234. Atleast one crystalline seed 238 can be placed contacting the secondcatalyst layer. The raw material flux surface 234 can be adjacent theraw material layer 220 opposite the first catalyst layer 212. As such, aportion of the raw material will diffuse into the second catalyst layeralong a second bulk raw material diffusion direction 240.

In an alternative embodiment of the present invention a plurality ofreaction assemblies can be placed within the high pressure volume.Typically, the reaction assemblies can be oriented in series such thatthe bulk diffusion directions of each growth cell are substantiallyparallel to each other and to the chamber axis. Further, the reactionassemblies can share common layers such as a support layer or can beseparated by a barrier layer. FIG. 2 illustrates an embodiment havingtwo reaction assemblies 242 and 244. The reaction assemblies areadjacent one another in a series configuration and share a commonsupport layer 246.

Alternatively, or in conjunction with the embodiment of FIG. 2, aplurality of reaction assemblies can be oriented in series within thehigh pressure volume having a barrier layer between reaction assemblies.FIG. 3 illustrates an embodiment having three reaction assemblies 248,250 and 252 separated by barrier layers 254 and 256. The barrier layercan be any material which is suitable for high pressure applications andwhich does not interfere with crystal growth, e.g., steel plates,dolomite, or the like. The barrier layers can be allowed to shiftslightly along the chamber axis during growth as the anvils advance, inorder to compensate for any volume reduction which occurs.

Any additional growth cells (whether in the same or separate reactionassemblies) can have substantially identical temperature gradients andmaterials such that grown crystals have substantially the same growthrates and quality, i.e. diffusion rates of raw material in each growthcell is substantially the same. Alternatively, each growth cell can havedistinct materials, e.g., cBN and diamond and/or differing temperaturegradients which result in differing growth rates.

In accordance with another aspect of the present invention, theplurality of pressure members can be provided by any number of highpressure devices. Several non-limiting examples of suitable highpressure devices can include split die devices, piston-cylinder presses,girdle devices, belt devices, tetrahedral presses, cubic presses, andtoroidal devices. Belt apparatuses can have curved frustoconical anvilswith corresponding curved die bores similar to that shown in FIG. 4.Likewise, girdle-type devices are similar to belt devices; however theanvils are flat surfaced frustoconical with corresponding die chambershaving flat tapers such as that shown in FIG. 1. In one currentlypreferred embodiment, the pressure members are provided by a split diedevice as described below.

In accordance with the present invention, a high pressure split diedevice can include a plurality of complementary die segments. The diesegments of the present invention can be assembled to form a diechamber. The die chamber can be at least partially filled with a highpressure assembly containing materials to be subjected to highpressures. A pair of anvils can be oriented such that an anvil is ateach end of the die chamber. The anvils can then be moved towards eachother to compress the high pressure assembly and apply force thereto.Additionally, a plurality of force members can be operatively connectedto the plurality of die segments to retain the die segments insubstantially fixed positions relative to each other during applicationof force by the pair of anvils. One advantage to this configuration isthat the die segments do not experience the same hoop tension around thedie circumference as a standard single piece belt die.

Referring now to FIG. 4, a high pressure split die device, showngenerally at 10, can include a plurality of complementary die segments12 and 14. Each die segment can have an inner surface 16 and an outersurface 18. The die segments can be configured to be assembled to form adie having a die chamber 20 capable of holding a high pressure assembly,such as the reaction assemblies described above. The die chamber 20 canhave a chamber axis 26 substantially along the center of the diechamber.

The die chamber 20 can be formed in a wide variety of shapes. FIG. 4illustrates a die chamber having a cylindrical portion having ends whichare tapered outward. The tapered portions are shown as taperinggradually to form a curved surface outward; however, the taperedportions can also be flat as shown in FIGS. 1, 5A and 7A. Alternatively,the die chamber can also be a straight cylinder without a taperedportion. Of course, the die chamber can also have a shape which does nothave a cylindrical portion, wherein the tapered portions at either endcomprise the entire die chamber volume similar to a typical belt die.Typically, in this embodiment, the die chamber has a length which isfrom about 0.5 to about 10 times the minimum chamber diameter.Regardless of the die chamber configuration, the die chamber can have alength of from about 0.5 to about 15 times the minimum chamber diameter.In some embodiments, the die chamber can have a length of from about 1to about 10 times the minimum chamber diameter. More specifically, inembodiments having multiple growth cells and/or reaction assemblies, thelength can be greater and in some embodiments can vary from about 2 toabout 10 times the minimum chamber diameter or from about 3 to about 10times. In an additional aspect of the present invention, the die chambercan have a reaction volume from about 1 cm³ to about 1000 cm³, andpreferably from about 5 cm³ to about 500 cm³.

Other die chamber configurations can also be used and are consideredwithin the scope of the present invention. In one aspect, the diechamber can have an interior surface which is substantially continuoussuch that when the die segments are assembled, a single chamber extendsthrough the assembled die segments. Preferably, the die segments can beshaped such that adjacent surfaces are flush and have substantially nospace between them when assembled, typically with corresponding gaskets.

The inner surfaces of the plurality of die segments can be configured toform a die chamber having a predetermined cross-section. Specifically,the inner surfaces can be, but are not limited to, arcuate, flat, orcontoured surfaces. For example, when assembled, arcuate inner surfacescan form a die chamber having a circular cross-section. Similarly, whenassembled, flat inner surfaces can form a die chamber having triangle,square, pentagon, and the like cross-sections, depending on the numberof die segments.

In accordance with the present invention, the number of complementarydie segments can vary from two to any practical number. In one aspect,the high pressure apparatus of the present invention can include fromtwo to ten complementary die segments. As the number of die segmentsincreases, the relative size of each segment decreases. As a result,each die segment can be sintered having a higher degree of homogeneityand fewer localized structural weaknesses than a single piece die orlarger die segments. However, a greater number of die segments can alsoincrease complexity and maintenance costs of the apparatus, as describedin more detail below in connection with increased numbers and complexityof support members and presses. Typically, the number of die segmentscan be from two to four. In one detailed aspect, the high pressureapparatus can include two complementary die segments. In anotherdetailed aspect, the high pressure apparatus can include fourcomplementary die segments.

The die segments can be formed of any hard material having a highcompressive strength. Examples of suitable hard material for forming diesegments of the present invention can include, but are not limited to,cemented tungsten carbide, alumina, silicon nitride, zirconium dioxide,hardened steel, super alloys, i.e. cobalt, nickel and iron-based alloys,and the like. In a preferred embodiment, the die segments can be formedof cemented tungsten carbide. Preferred cemented tungsten carbides canbe formed of submicron tungsten carbide particles and include a cobaltcontent of about 6 wt %. Those of ordinary skill in the art willrecognize other materials that may be particularly suited to such highpressure devices.

Referring again to FIG. 4, the outer surface 18 can be configured toattach to respective support members 21 and 23. The outer surface can beany configuration such as flat or contoured; however, typically theouter surface can be flat. Alternatively, the outer surface can have aconvex contour which transfers a portion of the applied stress toward acenter portion of the outer surface and reduce tensile stress along theexterior of the die segments 12 and 14. The support members are optionalin the high pressure apparatus of the present invention. However, it isoften preferable to provide support members to protect and reinforce themore expensive die segments. Typically, each die segment can have acorresponding support member. Alternatively, two or more die segmentscan be attached to a single support member. The support members can beformed of any hard material. Non-limiting examples of suitable hardmaterials include steel, hardened steel, metal carbides, ceramics, andalloys or composites thereof. Typically, the support members can behardened steel. The die segments 12 and 14 of FIG. 4 can be retained insubstantially fixed positions relative to each other via discrete forces17 and 19. Most often, the die segments and support members can beseparated by a thin gasket material, e.g., pyrophillite or talc. Thegasket material can provide improved sealing between surfaces and helpsto avoid local pressure spikes due to direct contact of two hardmaterials.

FIGS. 5A through 10 illustrate a few potential configurations forsegmented dies of the present invention. FIG. 5A shows a set of twocomplementary die segments 22 and 24, each engaged with a separatesupport member 21 and 23, respectively. The die segments can beassembled as shown in FIG. 5B to form die chamber 20 a. The die chambershown in FIG. 5B has a cylindrical portion and flat tapered portions ateach end of the cylindrical portion. Forces 27 and 29 can be applied tothe support members to retain the die segments together. An optionalgasket 25 can also be included between contacting surfaces of the diesegments and support members. The gasket can provide a seal betweensurfaces, as well as to electrically and/or thermally insulate.Typically, the gasket can be formed of known materials such as, but notlimited to, talc, pyrophillite, and the like. Additional materials suchas quartz and zirconia can be added to adjust various mechanical and/orthermal properties of the gasket.

FIG. 6A shows a set of four complementary die segments 32, 34, 36, and38, each engaged with a separate support member 31, 33, 35, and 37,respectively. The die segments can be assembled as shown in FIG. 6B toform die chamber 20 b. The die chamber shown in FIG. 6B has acylindrical portion and flat tapered portions at each end of thecylindrical portion. Forces can be applied to each of the four supportmembers to retain the die segments together. An optional gasket 25 a canalso be included between contacting surfaces of the die segments andsupport members. Additionally, optional gasket 25 b can be placed in thedie chamber, as is well known in the art.

FIG. 7A shows a set of four complementary die segments 42, 44, 46, and48 having no attached support members. As such, in some aspects of thepresent invention, the die segment may be used without a support member,or the die segment and support member can be a single integral piece.The die segments can be assembled as shown in FIG. 7B to form diechamber 20 c. The die chamber shown in FIG. 7B has a rectangular volumeand flat tapered portions at each end of the rectangular volume. Forcescan be applied to each of the four die segments to bring them together,and retain them in place when the anvils are used to apply pressurealong the chamber axis of the die chamber. An optional gasket 25 c canalso be included between contacting surfaces and between surfaces of thedie chamber and the high pressure assembly.

FIG. 8A shows a set of two complementary die segments 51 and 52, eachsurrounded by arcuate support members 53 through 58, respectively. Thedie segments can be assembled as shown in FIG. 8B to form die chamber 20d. The die chamber shown in FIG. 6B has a cylindrical portion and flattapered portions at each end of the cylindrical portion having a smallertaper angle than that of FIG. 8A. Forces can be applied to each of thesupport members to retain the die segments together. An optional gasket25 d can also be included between contacting surfaces of the diesegments and support members. Additionally, optional sleeves 59 and 60can be placed between the die segments 51 and 52 and support members 53and 56, respectively.

Similarly, a set of three complementary die segments can each beattached to a separate support member. The die segments can be assembledto form a die chamber. The die chamber can be shaped as in theconfigurations discussed herein. Forces can be applied to each of thethree support members to retain the die segments together. An optionalgasket can also be included between contacting surfaces of the diesegments and support members. Additionally, an optional gasket can beplaced in the die chamber, as is well known in the art.

FIG. 9 illustrates the four die segments and corresponding supportmembers of FIGS. 6A and 6B such that two die segments are attached toeach of two secondary support members 68 and 70. Each of the supportmembers have a slanted surface contacting the die segments such that thepressing force is substantially divided to form a pressing force againsteach die segment.

The above discussion has focused primarily on die segments wherein thedie segments are split along surfaces which are substantially parallelto the chamber axis along the center of the die chamber. However, in anadditional aspect of the present invention, the die segments can besplit in almost any configuration. For example, the die segments can besplit along a plane which is perpendicular to the chamber axis. FIG. 2shows gasket 316 placed between die segments 318 and 320 and gasket 322between die segments 324 and 326 having splits which are perpendicularto the chamber axis. In this case, the die segments are not firmlysecured to the respective supporting members 312 and 314, and areallowed to shift slightly along the chamber axis as the anvils advance.Die segments which split the die chamber perpendicular to the chamberaxis can allow for increased die chamber lengths and thus increased highpressure reaction volumes. Increased die chamber lengths allow foradditional growth cells and/or reaction assemblies in accordance withseveral embodiments of the present invention. In addition, perpendicularsplits can improve access to the reaction volume during assembly,cleaning of the device, or replacement of failed die segments. Further,the perpendicular split can also allow for convenient insertion ofthermocouples for temperature monitoring. As mentioned above,partitioning of the split die also reduces die segment production costsby allowing for smaller sintering masses and reduced non-homogeneoussintering.

Referring again to FIG. 4, a pair of anvils 70 and 72 can be orientedsuch that an anvil is at each end of the die chamber 20. The anvils canbe configured to apply pressing forces 13 and 15 substantially along thechamber axis through movement of the anvils towards one another toshorten the die volume. Most often, a high pressure assembly can beplaced in the die chamber such that the reaction volume is subjected tohigh pressure during application of force from the anvils. High pressureassemblies can contain a material to be subjected to high pressure suchas diamond seeds, graphite, catalysts, cBN seeds, hBN, and the like.Typically, the high pressure assembly can include metal braze coatings,gasket materials, graphite heating tubes, resistors, and the like. Thoseskilled in the art will recognize additional high pressure assemblycompositions and configurations which are useful for reaction and orexperimentation at high pressures.

Anvils 70 and 72 are shown as masses having frustoconical portions whichare shaped to fit into the ends of the die chamber 20. In connectionwith the present invention, suitable anvil shapes can also include,without limitation, frustopyramidal, piston, and the like. For example,frustopyramidal anvils can be useful for use with die chambers such asdie chamber 20 c shown in FIG. 7B. Frustoconical portions can have flatsurfaces (as in FIG. 4) or curved surfaces (as in FIG. 1). Anvils can beformed of any suitable hard material and is typically formed of cementedtungsten carbide, e.g., about 4% cobalt, although other materials can beused.

As the anvils advance, the materials placed in the die chamber have atendency to expand radially outward against the die segments. In orderto prevent movement of the die segments outward, a plurality of forcemembers can be operatively connected to the plurality of die segments.The force members can be configured to apply a plurality of discreteforces to the die segments, in some cases through the support members.The discrete forces should be sufficient to retain the plurality of diesegments in substantially fixed positions relative to each other duringapplication of force by the pair of anvils. Some minimal movement of diesegments can be permissible; however, significant movement can allow forexcess material to be forced into spaces between die segments. Moreimportantly, if the die segments are allowed to move significantly, thenthe pressure within the reaction volume is reduced. Typically, theanvils have a limited distance which they can enter the die chamber, ascan be seen in FIG. 4. Thus, when the die segments are allowed to move,the maximum achievable pressure is significantly reduced.

In an additional alternative embodiment of the present invention, theanvils can be operatively connected to an aligned column similar to thatshown in FIG. 10. An aligned column can help to prevent the anvils frombecoming offset or from tilting which typically results in failure ofeither the die or the anvils.

In accordance with the present invention, the force members can be anydevice or mechanism capable of applying force sufficient to retain thedie segments in substantially fixed positions. Several non-limitingexamples of suitable force members include uniaxial presses, hydraulicpistons, and the like. Hydraulic pistons and rams similar to those usedin tetrahedral and cubic presses can also be used in the high pressureapparatus of the present invention. Alternatively, the force members caninclude tie rods and hydraulic pistons similar to those used in astandard cubic press. In one specific embodiment shown in FIG. 10, theforce members can be pairs of platen 72 in a uniaxial press 74. Diesegments 76 and 78 are held in arcuate support members 80 and 82,respectively. Support members 80 and 82 are also held in additionalsecondary support members 84 and 86, respectively. The die segments areshown in a separated position. In this position, the die segments and/orsupport members can be easily replaced or adjusted and a reactionassembly placed therein. Further, subsequent to application of highpressure retraction of the die segments to a separated position can makeremoval of the high pressure assembly easier than with standard beltdies. In one aspect, wherein four die segments are attached to fourcorresponding support members, two uniaxial presses can be used toretain the four die segments in substantially fixed positions. Thesegmented force and associated support members of the present inventioncan be advantageous in that removal of die segments and opening of thedie chamber subsequent to application of high pressure is readilyaccomplished.

The die segments 76 and 78 can be assembled to form a die chamber byengaging the pair of platen 72 using the uniaxial press 74. As the diesegments move towards one another, optional guide pins 88 and 90 canensure that the die segments are correctly oriented and can help toprevent lateral movement during application of high pressure.

Regardless of the force members used, the force members can beconfigured to apply discrete forces to the die segments, either directlyor via corresponding support members. In one aspect of the presentinvention, the discrete forces can intersect at a common point and actin a common plane substantially perpendicular to the chamber axis.Typically, the common point is along the chamber axis in order toprevent sliding or offsetting of the die segments with respect to oneanother.

Referring to FIG. 5B, the two die segments 22 and 24 are retainedtogether using discrete forces 27 and 29. Discrete forces 27 and 29 canbe applied about 180° apart and about 90° to an interface plane definedby the interface of the die segments, corresponding generally to gasket25. Similarly, three die segments can be retained together usingdiscrete forces. The three discrete forces can act in a common planeabout 120° apart and about 60° to the die segment interfaces. FIG. 6Billustrates four die segments 32, 34, 36, and 38 being retained bydiscrete forces 102, 104, 106, and 108, respectively. Discrete forces102, 104, 106, and 108 can act in a common plane about 90° apart andabout 45° to the die segment interfaces.

The advancing anvils act as a wedge to push the die segments apart; as aresult, the amount of force required to retain the die segments togetheris typically greater than the force applied by the anvils. Therefore,the discrete forces combined can preferably be greater than the combinedpressure from the anvils. In one detailed aspect of the presentinvention, as the pair of anvils advance, pressure is placed on the highpressure assembly such that force is applied radially outward againstthe die segments. As a result, the combined discrete forces required inorder to retain the die segments can be greater than the pressure in thehigh pressure assembly. In addition, a typical die has an inner surfacearea larger than the anvils; consequently, the force (i.e. pressuretimes area) required to retain the die segments together is much largerthan the force required to advance the anvils. Typically, anvils canprovide a total pressing force of from about 100 metric tons to about10,000 metric tons, although forces outside this range can be used whichare sufficient to achieve the desired pressures.

In accordance with the above principles, the high pressure apparatus ofthe present invention can produce high pressures within the die chamber.High pressures of over about 2 MPa can be easily achieved. In oneaspect, the combined pressing forces are sufficient to provide ultrahighpressures. In one detailed aspect, the ultrahigh pressures can be fromabout 1 GPa to about 10 GPa, and preferably from about 2 GPa to about 7GPa, and most preferably from about 4 to about 6 GPa.

In yet another detailed aspect of the present invention, the supportmembers can be shaped to reduce tensile stress in a corresponding diesegment. Application of force to support members such as those shown inFIG. 5B can cause premature failure of the die segments. Specifically,upon applying force to the support members 21 and 23 the die segmentscan experience a high tensile stress along a circumference direction ofthe inner surface of the die chamber. This tensile stress tends to causecracking of the die segments perpendicular to the die bore, whereincracks have a genesis at the inner surface which then grows toward theouter surface. FIG. 11 illustrates a support member 110 having a singlearcuate die segment 112. The support member has an outer surface 114which is opposite the die segments. The outer surface can be preferablyinwardly contoured to form a profile configured to reduce tensile stressin the die segment. Optionally, a corresponding force member adjacent tothe support member can be inwardly contoured to form a similar profilewhich decreases tensile stress in the die segment during applicationhigh pressure.

The inward contour can be a slight inward concavity such as that shownin FIG. 11 (concavity exaggerated for clarity); however the inwardcontour can also be formed as a beveled surface having substantiallyflat surfaces which slope inward and meet at a maximum deviation, L_(D).Other inward contours can also be used which decrease tensile stress atthe inner surface of the die segment. The degree of inward contour isslight, and can be measured by the maximum deviation, L_(D), from astraight line for a given outer surface length (L), i.e. L_(D)/L×100. Inone aspect, the degree of contour can range from about 0.1% to about 2%;however, values outside this range can also be used. Specific ranges canbe calculated based on the die support member size, geometry, materialsused in the support member, and number of force members used in aparticular design. The degree of contour can be sufficient to distributeapplied load such that hoop tension at the die segments can beminimized. Those skilled in the art can make such calculations usingtheir knowledge and readily available software. When the die supportmember 110 of FIG. 11 is subjected to a discrete force, the outersurface 114 tends to flatten with a large portion of stress beingtransferred from the more expensive die segment 112 to the supportmember.

In addition to the contours shown in FIG. 11, the support members can becontoured along the direction of the chamber axis. By contouring thesupport members in this direction tensile stress along surfaces and in adirection parallel to the chamber axis can be minimized in the diesegments and support members. Specifically, tensile stress on the outersurface 114 tends to cause cracks perpendicular to the chamber axis.

Additionally, the die segment 112 can be shaped to reduce stress atcorners 116. For example, the corners can be rounded (as shown in FIG.11), tapered, or beveled. In this way, chipping or fracture of the diesegment at a sharp corner can be reduced. Of course, in someembodiments, any gasket material used between die segments having shapedcorners 116 can be designed to match the contours of the contactsurfaces 118. Preferably, the gasket material can be designed toeliminate or substantially fill any gaps between contact surfaces and/orthe reaction assembly.

In yet another alternative embodiment of the present invention, thegasket material and corresponding contact surfaces of the die segmentscan be contoured to control pressure distribution through the assembleddie segments and to reduce premature failure. Under ultrahigh pressuresthe pressure gradient from the inner surfaces of the die segments to theexterior surfaces of the die segments or supporting members can be verydramatic, i.e. typically from 1 atm (101,325 Pa) to 5.5 GPa. Generally,it is preferable to reduce sharp spikes or drops in pressure which causeadditional stress on die segments and support members. For example, thecontacting surface 118 can be flat with corresponding gasket materialshaving a constant thickness from the inner surface 120 of the diesegment to the outer surface 124 of the support member. In this case, amajority of the pressure drop occurs near the outer surface resulting ina large stress on the support member 110 in outer regions near thecontact surface.

In order to produce a more uniform pressure gradient, the contactsurfaces 118 and corresponding gasket materials can be contoured. FIG.12 illustrates one embodiment wherein the contact surface is contouredoutwardly toward the inner surface 120 and the outer surface 124 with amaximum at the interface between the support member 110 and the diesegment 112. The contact surface can be contoured with otherconfigurations such as flat, gradual sloped surfaces, or continuoustaper, i.e. from the inner surface to the outer surface. For example,the gasket material can be shaped such that the gasket material isthicker toward the inner surface and tapers to a thinner thicknesstoward the outer surface. Alternatively, the gasket can have a thickerportion at the inner surface which then tapers to a narrower thicknessnear the joint between the support member and the die segment at whichpoint the thickness can remain substantially the same or taper eitherinward or outward. In each of the above cases, the contact surfaces 118can be contoured to match the gasket shape.

Further, in designing such contoured contact surfaces and correspondinggaskets, a gradual decrease in pressure is desired. Typically, the slopeof the pressure change is related to the thickness of the gasket. Forexample, a thicker gasket can allow for a larger drop in pressure than athinner gasket. In addition, the difference between a thickest portionof the gasket and a thinnest portion of the gasket is typically verymoderate and can be less than about 3:1. Thus, by adjusting thethickness of the gasket material and the associated contact surfaces,the pressure gradient can be controlled to reduce mechanical stress atcertain portions of the die segment and/or support members.

The high pressure split die devices described above are particularlysuited to growth of crystalline bodies using the aforementioned highpressure reaction assemblies. An additional optional configuration forsuitable high pressure reaction assemblies having a controlled patternof crystalline seeds is described in more detail in U.S. Pat. No.6,159,286, which is incorporated by reference herein. The high pressurereaction assembly can then be subjected to a temperature and pressure inwhich diamond or cBN is thermodynamically stable. As the temperature andpressure are increased sufficiently to diamond growth conditions, thecatalyst material facilitates growth of crystal at the crystalline seedfrom the raw material. The growth conditions can be maintained for apredetermined period of time to achieve a specific size of growncrystal.

Typical growth conditions can vary somewhat; however, the temperaturecan be from about 1000° C. to about 1600° C. and the pressure can befrom about 2 to about 7 GPa, and preferably from about 4 to about 6 GPa.The appropriate temperature can depend on the catalyst material chosen.As a general guideline, the temperature can be from about 10° C. toabout 200° C. above a melting point of the catalyst. Growth time cantypically be from about 5 minutes to several days, and preferably lessthan about 50 hours.

In addition, the high pressure systems of the present invention caninclude a plurality of high pressure apparatuses each including at leastone growth cell. A plurality of high pressure apparatuses can beoriented in a variety of configurations such as in series or in parallelin order to increase production capacity. In one aspect, a plurality ofhigh pressure devices can be oriented in series. In one alternativeembodiment of a series orientation, the high pressure devices can shareat least one common anvil having two ends such that a pressing force isapplied substantially along the chamber axis of each apparatus. Forexample, FIG. 13 illustrates two high pressure apparatuses 260 and 262each having a reaction assembly 264 and 266, respectively. The two highpressure apparatuses can share a common double-sided anvil 268. In thisway a common press or device can be used to provide the pressing forcefor both high pressure apparatuses. In order to allow the anvils to movein order to compensate for volume reduction during high pressure growththe high pressure apparatuses can be configured to allow lateralmovement. For example, each high pressure apparatus can have separateforce members, e.g., uniaxial presses, which are mounted on a track,wheels, bearings, or the like which allows each of the anvils to enterthe die bore at substantially equal rates.

Although any suitable high pressure device can be used to provide thepressure members, in one preferred embodiment, the high pressureapparatuses can include pressure members which are split die segments270, 272, 274 and 276. As such, a plurality of discrete forces 278, 280,282 and 284, respectively, can be applied to the die segments to retainthe segments together during application of the pressing force.

In another alternative embodiment, the high pressure system of thepresent invention can include a plurality of high pressure apparatusesoriented in parallel. FIG. 14 illustrates two high pressure apparatuses286 and 288 oriented in parallel and sharing common force members.Specifically, force members can apply discrete forces 290 and 292.Adjacent high pressure apparatuses can share a common support member.Alternatively, as shown in FIG. 14, support members 294 and 296 can beseparated by a gasket 298. In effect, discrete force 290 is applied tosupport members 300 and 296, while discrete force 292 is applied tosupport members 302 and 294.

In one aspect of the present invention, the number of reactionassemblies and/or high pressure apparatuses can be increased while thedie chambers of each apparatus can be decreased in size. This allows foran increased number of growth cells having individual control of growthconditions for each crystalline seed for synthesis of high quality gemdiamonds. FIG. 15 illustrates one embodiment of the present invention,including nine high pressure apparatuses oriented in parallel. Each ofthe high pressure apparatuses can have several growth cells, with eachgrowth cell being maintained at optimal growth conditions. The size ofeach die chamber allows for substantially unimpeded growth of eachcrystal. Orienting a plurality of high pressure apparatuses can allowfor increased production throughput, while also allowing for individualcontrol of growth conditions within each high pressure growth cell. Thisis particularly advantageous when using the high pressure split diedevices described herein, which offer improved access to the die chamberand improved monitoring and control of temperature conditions of eachgrowth cell.

In either the series or parallel configurations it can often bedesirable to design one or more of the devices applying pressing ordiscrete forces to be movable in order to allow the forces and diesegments to remain aligned. For example, in FIG. 13 high pressureapparatuses 260 and 262 may need to move slightly together in order toprevent uneven entrance of the common anvil 268 and anvils 286 and 288into their respective die chambers. This movement can be provided usingany known hardware such as wheels, tracks, bearings, and the likeattached to the devices used to provide the pressing and/or discreteforces.

The apparatuses and methods of the present invention can provideadditional control and improved quality of individual grown crystals.The chamber axis 26 of the die chamber 20 can be vertical as shown inFIG. 4. However, as discussed above the chamber axis can preferably beoriented substantially perpendicular to gravity prior to application offorce by the anvils as shown in FIGS. 1 through 3 and 9 through 15.Depending on the composition of the high pressure assembly, a horizontalorientation of the assembly axis can help to reduce problems associatedwith differences in density and temperature gradients during diamondsynthesis. For example, during synthesis of diamond, the catalyst issubstantially molten such that lower density diamond (3.5 g/cm³) tendsto float on the more dense molten catalyst (density greater than 8g/cm³). Moreover, the molten catalyst may flow upward via convection, ifthe lower portion of the molten catalyst is at a higher temperature thanan upper portion. Such flow of molten catalyst or diamond is notdesirable, e.g., under the temperature gradient method of diamondsynthesis, convection can increase diffusion of carbon solute sufficientto disturb the growth rate of the seeded diamond resulting innon-homogeneous crystal formation and defects. Thus, one aspect of thepresent invention can include orienting the assembly axis, and typicallythe chamber axis, substantially perpendicular to gravity in order toeliminate or substantially reduce such effects.

In addition, in accordance with the present invention, temperatureprofiles within the plurality of growth cells can be actively controlledin order to maintain optimal growth conditions for each crystallineseed. Typically, in accordance with the temperature gradient method,each growth surface and/or crystalline seed can have a lower temperaturethan a corresponding raw material flux surface. Typically, thetemperature profile within each growth cell can be a negative gradientfrom the raw material to the crystalline seed. The temperaturedifference can vary, but is typically from about 20° C. to about 50° C.Further, temperature fluctuations at the crystalline seed below about10° C. are desirable in order to avoid defects or inclusions in agrowing crystal.

A variety of mechanisms can be used in order to maintain a desiredtemperature profile across the reaction assembly. Heating elements canbe provided in thermal contact with the raw material. Suitable heatingelements can include, but are not limited to, passing a current throughlow resistivity raw material, heating tubes, and the like. Similarly,the crystalline seed and growth surface can be cooled by thermal contactwith cooling elements. Suitable cooling elements can include, but arenot limited to, cooling tubes, refrigerants, and the like. Coolingelements can be placed adjacent existing pressure members or can beformed as an integral part of pressure members or reaction assemblies.For example, FIG. 1 shows cooling tubes 304 and 306 adjacent anvils 202and 204, respectively. In this case, the cooling tubes can contain acoolant liquid such as water or ethylene glycol. The anvils aretypically formed of a relatively high thermal conductivity metal such assteel or metal carbide. Heat can be removed from ends of the reactionassembly 210 via transfer through the anvils. Alternatively, additionalcooling elements can be added in embodiments including a plurality ofgrowth cells and/or reaction assemblies. For example, FIG. 2 illustratestwo reaction assemblies 242 and 244 sharing a common support layer 246.In this embodiment, it can be desirable to include cooling elements 308and 310 near the support layer which are integral with the supportmembers 312 and 314, respectively. Of course, the cooling elements canbe placed as close as possible to the crystalline seeds, while alsoretaining the structural integrity of support members and die segmentsunder high pressures.

As an additional aid to actively controlling temperature profiles,thermocouples can be used to measure temperature profile. Thermocouplescan be placed at various locations within each growth cell to determinewhether temperatures are being maintained within optimal growthconditions. The heating and cooling elements can then be adjusted toprovide adequate heating or cooling. Typical feedback schemes can beused to reduce fluctuations in temperature control, i.e. PID, PI, etc.Active control of temperature profiles can be especially convenient whenusing the split dies described herein. The breaks in the die segmentsallow for more direct access to the reaction assembly and high pressurevolume for thermocouples and heating or cooling elements. Thus, thegrowth conditions for each crystalline seed can be independentlycontrolled.

As a result of the present invention, improved crystals can be grownhaving high yield, increased throughput capacity, and increased gemquality. Although yield varies depending on the materials used, themethods of the present invention can produce high quality and gemquality diamonds and crystals having a yield of from about 2 to over 50gem quality diamonds, each larger than 1 carat, during each pressingcycle. This throughput of diamond is much higher than conventionalmethods which are typically limited to a single crystal larger than 1carat grown at optimal growth conditions.

In one embodiment of the present invention, diamond seeds can be grownto form gem quality diamonds. Growth rates of crystal can be from about1 mg/hr to about 10 mg/hr, and preferably from about 4 mg/hr to about 6mg/hr. The final grown crystals can have varying sizes depending on thesize of the crystalline seed and growth time. However, gem qualitydiamonds can have a size of from about 0.5 carat to about 30 carats, andpreferably from about 1 carat to about 5 carats.

Thus, there is disclosed an improved high pressure apparatus and methodsfor applying high pressure and ultrahigh pressure to materials. Theabove description and examples are intended only to illustrate certainpotential embodiments of this invention. It will be readily understoodby those skilled in the art that the present invention is susceptible ofa broad utility and applications. Many embodiments and adaptations ofthe present invention other than those herein described, as well as manyvariations, modifications and equivalent arrangements will be apparentfrom or reasonably suggested by the present invention and the foregoingdescription thereof without departing from the substance or scope of thepresent invention. Accordingly, while the present invention has beendescribed herein in detail in relation to its preferred embodiment, itis to be understood that this disclosure is only illustrative andexemplary of the present invention and is made merely for purpose ofproviding a full and enabling disclosure of the invention. The foregoingdisclosure is not intended or to be construed to limit the presentinvention or otherwise to exclude any such other embodiment,adaptations, variations, modifications and equivalent arrangements, thepresent invention being limited only by the claims appended hereto andthe equivalents thereof.

1. A high pressure system, comprising a high pressure apparatusincluding: a) a plurality of pressure members configured to form a highpressure volume; and b) a first high pressure reaction assembly which isplaced in the high pressure volume, said reaction assembly comprising:i) a first catalyst layer having a crystal growth surface and a rawmaterial flux surface; ii) at least one crystalline seed contacting thecatalyst layer; and iii) a raw material layer adjacent the raw materialflux surface of the first catalyst layer, the raw material layer beingconfigured to allow raw material to diffuse into the catalyst layeralong a bulk raw material diffusion direction that is orientedsubstantially perpendicular to gravity within the high pressure volumeduring application of high pressure.
 2. The system of claim 1, furthercomprising a second catalyst layer having a crystal growth surface and araw material flux surface and at least one crystalline seed contactingthe second catalyst layer, said raw material flux surface of the secondcatalyst layer being adjacent the raw material layer opposite the firstcatalyst layer.
 3. The system of claim 1 or 2, further comprising asupport layer in contact with the crystal growth surface of the catalystlayer.
 4. The system of claim 3, wherein the crystalline seed contactsthe crystal growth surface and the support layer at least partiallysurrounds each crystalline seed.
 5. The system of claim 4, furthercomprising a second reaction assembly adjacent the first wherein thefirst and second reaction assemblies share a common support layer. 6.The system of claim 3, further comprising a plurality of reactionassemblies oriented in series within the high pressure volume.
 7. Thesystem of claim 1, further comprising a plurality of high pressureapparatuses oriented in parallel.
 8. The system of claim 1, furthercomprising a plurality of high pressure apparatuses oriented in series.9. The system of claim 1, wherein the raw material is a carbon sourceconfigured for growing diamond from the crystalline seed.
 10. The systemof claim 9, wherein said catalyst layer comprises a carbon solventselected from the group consisting of Fe, Ni, Co, Mn, Cr, and alloysthereof.
 11. The system of claim 10, wherein said catalyst layercomprises an Fe—Ni alloy.
 12. The system of claim 9, wherein said rawmaterial layer comprises low resistivity graphite.
 13. The system ofclaim 9, wherein said raw material layer comprises diamond powder. 14.The system of claim 1, wherein the raw material is a low pressure phaseboron nitride source configured for growing cubic boron nitride from thecrystalline seed.
 15. The system of claim 14, wherein the catalystmaterial is a member selected from the group consisting of alkali,alkaline earth metal, and compounds thereof.
 16. The system of claim 1,wherein the crystalline seed is a member selected from the groupconsisting of diamond seed, cBN seed, SiC seed, and combinationsthereof.
 17. The system of claim 1, wherein said plurality of pressuremembers comprises a high pressure press selected from the groupconsisting of split die device, piston-cylinder press, girdle device,belt device, tetrahedral press, cubic press, and toroidal device. 18.The system of claim 17, wherein said pressure members are a split diedevice, comprising: a) a plurality of complementary die segments, eachdie segment having an inner surface and an outer surface, wherein theinner surfaces are configured to form a die chamber having a chamberaxis upon assembly of the plurality of die segments, said chamber axisbeing oriented substantially perpendicular to gravity during applicationof high pressure; b) a pair of anvils oriented such that an anvil is ateach end of the die chamber and configured to apply force substantiallyalong the chamber axis; and c) a plurality of force members operativelyconnected to the plurality of die segments and configured to apply aplurality of discrete forces to the plurality of die segments sufficientto retain the plurality of die segments in substantially fixed positionsrelative to each other during application of force by the pair ofanvils.
 19. The system of claim 18, comprising from two to tencomplementary die segments.
 20. The system of claim 18, wherein the diechamber has a length of from about 0.5 to about 10 times the minimumdiameter.
 21. The system of claim 18, wherein the discrete forcesintersect at a common point and act in a common plane substantiallyperpendicular to the chamber axis.
 22. The system of claim 18, whereinthe die chamber has a reaction volume from about 5 cm³ to about 500 cm³.23. The system of claim 18, further comprising a plurality of split diedevices oriented in series, wherein said devices share at least onecommon anvil, said anvil having two ends, each configured to apply forcesubstantially along the chamber axis.
 24. The system of claim 18,further comprising a plurality of split die devices oriented inparallel, wherein said devices share common force members.